Harm van Marwijk, Mechanical Engineering student, has enthusiastically started the 3rd year of his studies. He is now doing an internship at Boschman Advanced Packaging Technology in Duiven. During his 3rd-year internship at HAN, he wants to develop further in this high-tech world of fine mechanical engineering. From this internship, he gets to gain experience abroad in Singapore!

Harm van Marwijk with tooling (mould-set) designed and produced at Boschman.

Assembly in Singapore

Together with supervisors at Boschman, Harm managed to set up a very cool internship assignment. Within this assignment, a Factory Acceptance Test with associated tooling will be developed for machines Boschman designs and manufactures. “The aim is to raise the quality of these systems by performing a proper final check. As a result, fewer errors will emerge on site at the customer’s premises. As these machines are assembled in Singapore, I will be working at that location from October to December. A very nice challenge both personally and professionally!”

Transition from mbo to hbo

“I previously studied at mbo. After my Mechatronica mbo-4 graduation internship at Boschman, I have always continued to work here – alongside my studies. As a result, my interest in semiconductor packaging technology continued to grow.”

Harm experienced the transition from mbo to hbo as a big hassle, but in the end it gave him many new opportunities. “I certainly wouldn’t have wanted to miss those. Especially the beginning of the Mechanical Engineering course was tough with all kinds of new mathematics. Still, it all worked out well because I invested a lot of time in it myself.”

Also interested in precision mechanical engineering?

If – like Harm – you also want to delve further into high-tech mechanical engineering, then HAN’s Semiconductor Packaging minor is definitely for you! Especially if your interest lies in the world of semiconductors and chip packaging, such as for embedded antennas and sensors.

Minor Semiconductor Packaging

The challenging minor Semiconductor Packaging will introduce you to the semiconductor industry and familiarize you with the last step of chip manufacturing. This is the phase in which the chip is ‘packaged’ in its housing. This packaging is becoming increasingly complex. Developments such as System-on-Chip, embedded antennas for 5G and sensors make high demands on the production process and the competences of the employees involved. Packages are becoming very complicated and application-specific, while costs have to be kept low.

This minor therefore focuses on the design and manufacturing of semiconductor packages and the associated assembly techniques. You will be tutored by the Chip Integration Technology Centre (CITC) and may also be employed by partners such as NXP, Nexperia, Ampleon, TU Delft and TNO.

More about the Boschman company

Did you already know that Boschman Advanced Packaging Technology is a high-tech, engineering-driven and international company focused on advanced back-end semiconductor packaging solutions? They offer a dedicated one-stop-shop concept, from idea to industrialisation, for semiconductor packaging activities. They specialise in the development and supply of advanced transfer molding and sintering systems.

The company focuses on well-defined high-growth market segments, including power electronics (Automotive, Smart Grid and Industrial Engineering), Micro-ElectroMechanic Systems (MEMS) and sensors. The global energy transformation and electrical revolution requires next-gen products, technologies, processes and materials.

Boschman is therefore also targeting these opportunities with technology leadership in Pressure Sintering and Advanced Molding, supported by their patented technologies and unrivalled packaging expertise.

Sources: HAN, Boschman Advanced Packaging Technology
Photography: Harm van Marwijk